IPC-7711/7721 — Rework, Modification & Repair of Electronic Assemblies

Certified IPC Specialist (CIS) | 5-Day Training Course Outline

Course Overview

The IPC-7711/7721 Certified IPC Specialist (CIS) certification course is the electronics industry’s gold standard for professionals responsible for the rework, modification, and repair of electronic assemblies. Delivered across five intensive days, this program combines lecture-based instruction with approximately 85% hands-on lab practice, equipping participants with the skills to work on plated through-hole (PTH) and surface mount (SMT) assemblies in full compliance with IPC standards.

Upon successful completion of the written exam (≥70%) and practical workmanship evaluations, participants are awarded the internationally recognised IPC CIS Certification, valid for 24 months.

Who Should Attend: PCB rework technicians, electronics repair specialists, quality assurance personnel, production engineers, and anyone working in aerospace, defense, medical device, or high-reliability electronics manufacturing.

Prerequisite: Proficient soldering skills, including fine-pitch work, are required prior to enrolment.

🎯 Learning Objectives

By the end of this 5-day course, participants will be able to:

• Interpret and apply IPC-7711/7721 standard procedures for rework, repair, and modification

• Correctly classify products under IPC Class 1, 2, and 3 requirements

• Perform hands-on rework on through-hole, SMD, and area array (BGA) components

• Execute conformal coating identification, removal, and re-application

• Carry out conductor, pad, and laminate repair to IPC-conformance levels

• Apply ESD control, lead-free soldering practices, and quality documentation protocols

📅 5-Day Course Structure

Day 1 — Module 1 (Mandatory): Foundations, Policies & IPC-7711/7721 Introduction

This foundational module is mandatory for all CIS candidates and establishes the framework for the entire programme.

Topics Covered:

• Introduction to IPC-7711 (Rework) vs. IPC-7721 (Repair & Modification) — understanding the combined standard

• IPC Product Classifications — Class 1 (General), Class 2 (Dedicated Service), Class 3 (High Reliability)

• Key definitions: Rework vs. Repair vs. Modification and why the distinction matters

• Skill levels — Intermediate, Advanced, and Expert

• Conformance levels — High (H), Medium (M), Low (L)

• Tools, equipment, and materials overview: soldering stations, hot-air systems, desoldering tools, microscopes

• ESD control and handling requirements (ESD S20.20)

• Lead-free vs. tin-lead soldering considerations

• Documentation, traceability, and quality system requirements

• Relationship with companion standards: IPC-A-610, J-STD-001, IPC-A-620

Day 2 — Modules 2–4: Wire Splicing, Conformal Coatings & Through-Hole Rework

Module 2 — Wire Splicing Procedures

• Mesh, wrap, hook, and lap splice techniques

• Wire preparation, insulation removal, and strain relief

• Acceptance criteria and conformance levels per product class

Module 3 — Conformal Coating Removal & Replacement

• Identifying coating types: Acrylic, Epoxy, Silicone, Urethane, and Parylene

• Removal methods: solvent, mechanical, thermal, micro-abrasion, and laser

• Localized coating re-application: brush and spray techniques

• Visual inspection and test methods

Module 4 — Through-Hole Component Rework

• Desoldering methods: continuous vacuum, wicking, partial- and full-clinch techniques

• PGA and connector removal procedures

• Land preparation and tin/lead vs. lead-free alloy considerations

• Component installation and solder joint inspection

Hands-on Lab: Through-hole desoldering and reinstatement on live practice boards

Day 3 — Modules 5–7: Surface Mount Component Rework

Module 5 — Chip & MELF Component Rework

• Hot-air and conduction removal of passive chip components (0201–2512) and MELF

• Land preparation, solder paste application, and placement

• Inspection to IPC-A-610 acceptance criteria

Module 6 — Gull-Wing SMD Rework (SOIC, QFP, SOT)

• Focused hot-air removal and installation procedures

• Bridging, tombstoning, and misalignment corrective techniques

• Fine-pitch gull-wing rework best practices

Module 7 — J-Lead Component Rework (PLCC)

• Hot-air removal and controlled site preparation

• Correct placement orientation and solder reflow methodology

• Inspection of J-lead joints per Class 2 and Class 3 requirements

Hands-on Lab: SMD chip, SOIC, QFP, and PLCC removal and replacement under magnification

Day 4 — Module 8 & 9: BGA Rework & Laminate Repair

Module 8 — BGA & Area Array Component Rework (Expert Level)

• BGA, CSP, QFN, and LGA package types and challenges

• Thermal profile development for lead-free BGA rework (peak ≤245°C)

• Bottom-side preheat requirements and nitrogen atmosphere use

• BGA removal using focused IR reflow systems

• Site cleaning, pad inspection, and flux residue management

• BGA reballing: fixture method, paper carrier method, and polyimide stencil method

• BGA installation, X-ray inspection, and failure analysis overview

• Note: BGA module includes lecture plus supervised lab demonstration

Module 9 — Laminate Repair

• Delamination and blister repair — epoxy injection method

• Bow and twist correction

• Hole repair: epoxy and transplant methods

• Base material repair for burn damage and mechanical trauma

• Skill and conformance level requirements for Class 3 laminate repair

Hands-on Lab: BGA site preparation and reballing demonstration; laminate repair exercises

Day 5 — Module 10 & Certification Exams: Circuit Repair & Assessment

Module 10 — Circuit Repair (Conductors, Pads & Modifications)

• Lifted land repair: epoxy and film adhesive methods

• Surface conductor repair and inner-layer conductor procedures

• Plated through-hole repair: eyelet, epoxy, and solder methods

• Edge connector repair techniques

• Circuit modification: trace cutting, jumper wire installation, BGA foil jumper and through-board methods

• Component addition for engineering change orders (ECOs)

Certification Examination Block:

• Written Exam — Open-book, 70% pass mark required (two attempts included)

• Practical Workmanship Exams — Hands-on evaluation for each selected optional module

• Certification review, feedback session, and certification award

📜 Certification Details

🔗 Related IPC Standards & Complementary Courses

• J-STD-001 — Requirements for Soldered Electrical & Electronic Assemblies (CIS)

• IPC-A-610 — Acceptability of Electronic Assemblies (CIS)

• IPC-A-620 — Requirements for Cable and Wire Harness Assemblies

• IPC-7711/7721 CIT — Certified IPC Trainer (Train-the-Trainer, 5 days)

Certification granted through an IPC Authorised Training Centre. All course content aligned with the current IPC-7711/7721 Revision D (2024) standard. Course duration may vary slightly based on participant skill levels. IPC | Blackfox Training | EPTAC | PCBSync IPC Guide